The Inerting Process

 All Wenesco wave solder pots and static pots can be inerted with nitrogen to prevent or reduce oxidation from forming at the interface of the solder surface and the atmosphere. 

This sketch illustrates how a typical wave solder pot, often used as a component in an automated soldering system, may be inerted to reduce maintenance.

  Nitrogen tank (or plant nitrogen supply) with regulator and gauge, usually set at 15 psi.

  Flow meter for the PUMP INERTER is usually set for 5-10 CFH.  The pump inerter is used specifically to eliminate black powdery oxides produced around the pump shaft.

  Flow meter for the WAVE INERTER controls nitrogen flow into porous tubes   which produce laminar flow across the   wave nozzle. This prevents oxides from forming on the wave surface in certain applications.  Note that the nozzle is HIGHER than the tubes.

The nitrogen first enters the wave   control box where you may opt to permit nitrogen flow only when the solder pump is operating.  The flow meter setting depends on the size of the nozzle. We estimate 50 CFH on the average. 

  Flow meter for the POT INERTER controls nitrogen flow to the surface of the solder bath, eliminating most of the dross on the solder surface.  The flow meter setting depends on the size of the hole in the top cover.

Estimate 15-20 CFH loss per square inch of exposed solder surface.


NITROGEN LOSS FROM THE POT:  The exposed surface around the solder nozzle is the space allowed for the solder from the solder nozzle to spill back into the pot thru the top cover For example: If the nozzle is 1" X 4 "(4 sq inches), the hole in the top cover will be 2" X 5"(10 sq inches). 10 sq inches less 4 sq inches= 6 sq inches of exposed solder surface The nitrogen loss from the pot is therefore estimated at 6 x 15CFH=90 CFH

NITROGEN LOSS FROM THE WAVE NOZZLE:  There is a provision in the control to initiate nitrogen flow only when wave solder flow is activated. Nitrogen remains on only as long as the wave solder is flowing. Covers to minimize nitrogen loss may be used to further minimize loss. The design of these covers, of course, is dictated by the parameters of the soldering application.